These compounds are commonly used with transistors diodes rectifiers and transformers.
Thermal compound for heat sink.
Thermal paste is a thermally conductive chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.
Silicone compound blended with thermally conductive fine metal oxide powders.
Temperature range from 45 degrees f to 500 degrees f.
Free in store or curbside pick up.
Parts are just part of what we do.
Zinc oxide compounds create a more secure bond than silicone compounds.
Excellent heat transfer efficiency.
This is a test.
The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.
Super lube silicone heat sink 3 oz.
Since the grooves between the heatsink and the processor aren t perfectly even the thermal compound is perfect for use as a conduit to facilitate better heat transfer.
Thermal paste is an example of a thermal interface material.
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Will not react to rubber or plastic.
Wells heat sink compound 1 ea.
Wigbow thermal compound paste heatsink paste carbon based high performance thermal compound cpu for all coolers thermal interface material high durability 4 grams 1 pack 4 6 out of 5 stars 315 6 99 6.
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Heat sink compounds bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.
Will not harden or melt.