Thermal Epoxy Heat Sink

These highly effective thermal interface materials contain special alumina boron nitride silica aluminum nitride fillers or particles to improve device reliability and longevity.

Thermal epoxy heat sink.

Serviceable from 4k to 400 f. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications. One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable.

50 3186 nc is a two part thermally conductive epoxy adhesive. This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and led lighting thermal management. One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance.

50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance. In addition to providing strong bonds and thermal conductivity the 70 3812nc passes nasa s outgassing requirements per astm e 595 07. 3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications. This thixotropic adhesive provides high temperature bonds to a variety of substrates.

These customizable liquid tapes pads or a mix means reliable high thermal performance less waste and just in time supply.