Thermally Conductive Epoxy High Temperature

Thermo bond 54 is recommended for high temperature aerospace and electronic applications where the c.

Thermally conductive epoxy high temperature.

Thermal adhesive tape 20mm by 25m hpfix high performance thermally conductive tape apply for coolers heat sink led strips computer cpu gpu easy to apply high durability 4 4 out of 5 stars 101 12 99 12. Serviceable from cryogenic temperatures up to 400 f. Thermally conductive electrically insulating heat cure epoxy high temperature resistance. Master bond ep30tc is a multifaceted epoxy for use in thermal management applications.

Sets at room temp. Aluminum metal filled epoxy that cures at room temp to form machinable thermally conductive bond lines. Will cure at room temperature. When used as an adhesive the thermally conductive filler has very fine particle sizes.

Omegabond 100 two part epoxy. Duralco 132 500 f aluminum filled epoxy. Sets at room temp. 50 3186 nc is a two part thermally conductive epoxy adhesive.

Duralco 132 offers the maximum conductivity available in a 500ºf epoxy system. Very high thermal conductivity. Resist oils solvents most acids. Serviceable from 100 f to 400 f.

Two part room temperature curable epoxy system with high thermal conductivity. Aremco bond 805 is a two component 100 solids aluminum filled epoxy ideal for bonding potting and tooling applications to 300 ºc 572 ºf. Thermally conductive epoxy adhesive black alumina filled casting low exotherm. Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity.

Subsequently it can be applied in sections as thin as 5 15 microns. Aremco bond 805 a new high temperature thermally conductive epoxy system developed by aremco products inc is now for bonding potting and molding applications to 300 ºc 572 ºf. Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity. Good to 105 c 221 f omegabond 200 two part epoxy.

This thixotropic adhesive provides high temperature bonds to a variety of substrates. Can be supplied as a non sag putty for heat tracing applications. It is a specialty formulation that can be used for bonding coating sealing and encapsulation. Idea for joining dissimilar substrates.

Thermo bond 180 is designed for the fastest and most continuous high heat transfer. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance.